In the field of semiconductor manufacturing, wafer cleaning is a crucial process to ensure the quality and performance of chips. If there are particulate impurities, metal impurities, organic impurities, etc. on the surface of the silicon wafer, problems such as current leakage and low breakdown voltage will occur, seriously reducing the chip yield.

As a commonly used wafer cleaning tool, the spray cleaning equipment plays an important role. Its working principle is to generate high-pressure water or chemical solutions through a high-pressure pump, and form high-pressure water columns or fine water mists through specially designed nozzles to strongly impact and wash the surface of the wafer. During the cleaning process, the high-speed water flow can effectively peel off various pollutants on the surface of the wafer and remove them from the wafer surface.

Compared with other cleaning methods, the spray cleaning equipment has significant advantages. In terms of operation, it is relatively simple, making it easy for workers to get started and for daily maintenance. It has a high cleaning efficiency and can quickly complete the cleaning of wafers to meet the needs of large-scale production. In general cleaning processes, it can perform tasks excellently, effectively remove common dirt on the surface of wafers, ensure the cleanliness of wafers, lay a good foundation for subsequent chip manufacturing processes, and help improve the overall quality and efficiency of chip manufacturing.